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In transmission electron microscopy (TEM), often the preparation of samples is the most critical part. Specimens have to have disk geometries of 3 mm diameter laterally, and they have to be transparent for the electron beam vertically. Therefore, a specimen thickness in the range of some 1 – 10 nm has to be achieved by the preparation process. While shrinking the specimen dimensions, care has to be taken to recover the materials properties in the nm-regime. We report and shortly discuss some TEM specimen preparation techniques mainly used in the Stuttgart TEM specimen preparation laboratory. Furthermore, we demonstrate how more advanced techniques lead to a more reliable preparation of weakly-bonded metal/SrTiO 3  interfaces. In addition, the advantage of low-voltage ion-milling is demonstrated by a case study for bulk SrTiO3. As a result, low-voltage ion polishing as a final step in the TEM specimen preparation by conventional ion-thinning turns out to significantly increase the specimen quality. In turn, the interpretation of high-resolution TEM micrographs and electron energy-loss near-edge structures becomes much more straightforward.

Progress in the preparation of cross-sectional TEM specimens by ion-beam thinning