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The intermetallic compound that appears during the soldering reaction between pure Sn and Ni substrate at temperatures ranging from 250 to 400 °C is analyzed to be Ni 43 Sn 57  A similar reaction at the Sn– 58Bi/Ni interface results in the formation of the Ni 41.5 Sn 57.9 Bi 0.6  phase. At the Sn/Ni and Sn–58Bi/Ni interfaces, each kind of intermetallic compound formation exhibits a similar scallop-type morphology. However, the growth rate of intermetallic compounds at the Sn/Ni interface is greater than that at the Sn– 58Bi/Ni interface. The growth kinetics for both cases is diffusion controlled. The activation energy for the intermetallic growth at the Sn/Ni interface is 43.7 kJ/mol, which is higher than that at the Sn–58Bi/Ni interface (28.3 kJ/mol).

Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn– 58Bi solders with Ni substrates