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In a series of solidification experiments, the solidification morphology of 14 different solder alloys based on Pb–Sn2 with additions of 1 – 4 wt.% Ag and 0.3 – 1.2 wt.% Cu has been correlated with the cooling conditions through a quantification of microstructural features. Joints of these solders in assemblies similar to components in the electronics were exposed to thermal cycling. The damage in the solder material due to thermal fatigue has been quantified with the aid of a dye penetration test. Fracture surface analysis was used to evaluate the reliability of this test. The highest resistance against thermal fatigue was found in Pb–Sn2–Ag1– Cu0.3. The varying thermal fatigue resistance is attributed to a change of solidification morphology from columnar to equiaxed, which in turn is a consequence of changes in phase fraction and morphology of secondary phases due to slight variations in alloy composition.

Thermal fatigue resistance in Pb-based solder alloys for electronic packaging