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The creep behavior of the near α Ti alloy IMI 834 was investigated in the temperature regime around 600 °C, comparing a fully lamellar and two bi-modal microstructures consisting of 15 and 40 vol.% equiaxed primary α phase in a lamellar matrix of transformed β phase. The width and length of the α lamellae of all three microstructures was varied by changing the rate of cooling from the recrystallization temperature. The width of the α lamellae decreased continuously with increasing cooling rate. The creep resistance exhibited the generally observed dependency to increase slightly with increasing cooling rate, to pass over a maximum and then to decrease drastically. This cooling rate dependent creep resistance is tentatively thought to be controlled by two competing mechanisms, an increasing amount of deformation strengthening as a result of the continuously decreasing interface distance and an increasing rate of recovery of dislocations at interfaces as a result of the drastically increasing density of interfaces which depends in a first approximation on the reciprocal interface distance. The observed lower creep resistance of the bi-modal as compared to the fully lamellar structure is thought to result from the alloy element partitioning effect reducing the strength of the lamellar matrix of the bi-modal in comparison to the fully lamellar microstructure.

Correlation Between Microstructure and Creep Behavior of the High-Temperature Ti Alloy IMI 834