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The thermal bonding method is an advanced processing technology, which can bond a variety of polymer sheets on request. This work aims to analyze the effect of applied loading, heating temperature and duration on the depth loss of the PMMA microfluidic chip after bonding. Several experiments were designed by us and the results were analyzed by orthogonal experimental method. Finally optimal applied loading, heating temperature and duration were obtained and in the optimal case, the bonded microfluidic chip has small depth loss and enough strength.

Research on Optimizing Parameters of Thermal Bonding Technique for PMMA Microfluidic Chip