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Standard metallographic cross-sectioning of copper and gold wire bonds with underneath Cu/low-k interconnect layers are difficult, easily they fracture during polishing. It can be overcome by appropriate liquid molding methodology and polishing using semi-automatic system at very low frictional forces and using finer alumina or diamond lapping films. SEM observation of the polished microstructures up to 5000–8000× magnification does not reveal micro cracks or smearing of copper.

Mechanical Cross-Sectioning of Au/Cu Wire Ball Bond with Underneath Cu/low-k Interconnect Layers