English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Zendy Open

Presents the pdf analysis as premium feature

PDF Analysis

Insights

Presents the summarisation as premium feature

Summarisation

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the zaia usage as premium feature

ZAIA

Zendy Tools

Zendy Plus

Presents the access of premium content as premium feature

Premium Content

This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy.

international journal of materials research

Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys: Paper presented at the “International Conference on Processing and Characterization of Materials 2018, ICPCM 2018”, 6–8 December 2018, Rourkela, India