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Electroless nickel coating on poly(ethylene terephthalate) board via a copper-catalyzed process is reported. Poly(ethylene terephthalate) was firstly modified by organic silanes to graft thio groups onto its surface, and then covered with copper particles and clusters in solution with dimethyl amineborane as a reducing reagent. This copper-activated board was dipped into a nickel electroless solution for metallization. An Ni/Cu/poly(ethylene terephthalate) composite was obtained in which the copper interlayer served as both catalyst and interlocker for the formation of the composite. X-ray diffraction and energy dispersive X-ray analysis indicated that the metallic layer was composed of Ni and Cu. Atomic force microscopy revealed that the metal layer was smooth with root-mean-square roughness of 5.98 nm (area: 3 μm × 3 μm). The adhesion of the plated film to the polymer was measured to be 16.3 N cm −1 , higher than those from traditional processes. The Ni/Cu/poly(ethylene terephthalate) composite was conductive and magnetic, and could be used for electromagnetic interference shielding.

Copper-catalyzed electroless nickel coating on poly(ethylene terephthalate) board for electromagnetic application