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Copper was electrodeposited at different current densities with additive modifications of the plating bath. With respect to applied current density there is modification of the microstructure as well as the physical properties of the copper deposit. There is notable change in cathodic potential, as revealed from polarization analysis, with  Mw  of poly ethylene glycol. The increase in current density increased crystallite size and increased the hardness of the deposit. There is significant change in grain size and shape with respect to applied current density in the case of the same kind of additives. The crystallographic orientation of the deposit has a prominent (220) plane for deposit at high current density and the ratio  I  (111) / I  (220)  decreased with increase in current density. The observed changes can be envisaged as due to the adsorption nature, nucleation characteristics with respect to various additives and also on the hydrogen evolution rate with applied current density, which influenced the deposit character.

Effect of additive and current density on microstructure and texture characteristics of copper electrodeposits