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Based on indentation experiments under different loads, the mechanism of ductile-regime grinding of SiCp/Al composites has been investigated. The factors that influence the ductile-regime removal of SiC particles, such as tip radius of abrasive grains, intrusion depth, and volume fraction of SiC particles, have been analyzed by three-dimensional finite element simulation. The calculation results indicate that a sharp abrasive grain without tip radius cannot produce a plastic deformation region under the indenter and brittle fracture of the SiC particle takes place rather than ductile model of failure. The critical grinding depth of ductile-regime removal decreases with increasing tip radius of abrasive grains, but increases with decreasing SiC particle volume fraction.

Study of the mechanism of ductile-regime grinding of SiCp/Al composites using finite element simulation