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Brazing of copper to copper using phosphor–copper brazing filler metal has been carried out using vacuum brazing technology. The wettability, melting performance, microstructure and phase constitution in the joint were studied by means of differential thermal analysis, metallography, energy dispersive X-ray detector and X-ray diffraction. Experimental results obtained showed that the structure in the joint consisted of hypoeutectic alloy. The primary phase is copper solid solution (α(Cu)) and silver solid solution (α(Ag)). The eutectic phase is copper solid solution (α(Cu)), silver solid solution (α(Ag)) and Cu 3 P. The optimum process parameters are: brazing temperature T = 820–850°C, vacuum level p = 10 −3  Pa, holding time t = 5–10 min.

Microstructural analysis in the vacuum brazing of copper to copper using a phosphor–copper brazing filler metal