English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Zendy Open

Presents the pdf analysis as premium feature

PDF Analysis

Insights

Presents the summarisation as premium feature

Summarisation

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the zaia usage as premium feature

ZAIA

Zendy Tools

Zendy Plus

Presents the access of premium content as premium feature

Premium Content

Structural characterization techniques, including solid-state nuclear magnetic resonance and Fourier transform infrared spectroscopies, were used in conjunction with mechanical testing to study the effects of thermally activated electron bombardment curing on organosilicate thin films. The electron beam process produced significant improvements in elastic modulus and fracture resistance while still preserving low dielectric constant. Detailed and quantitative analysis was used to elucidate fundamental curing effects on glass structure, including changes in film composition and local bond rearrangements. Enhancements in fracture properties with curing are shown to be due to increased network bond density resulting from changes in network connectivity coupled with moderate film densification.

Effects of e-beam curing on glass structureand mechanical properties of nanoporous organosilicate thin films