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The vast majority of man-made devices contain joints between similar or dissimilar materials. Ideally, joining is fast, reliable, and inexpensive. In this work we demonstrate that robust refractory joints between Al 2 O 3  bodies can be produced rapidly and consistently by a transient-liquid-phase bonding process exploiting microengineered multilayer Ni/Nb/Ni interlayers. Samples were bonded for times ranging from 5 min to 6 h at 1400°C. Well-bonded assemblies were produced in all cases. Interlayers with remelt temperatures &gt; 2200°C were achieved in as little as 5 min at 1400°C. In room-temperature bend tests, fractures initiated and propagated almost exclusively in the ceramic. Extension of this approach to other advanced ceramics should be possible, providing a rapid and reliable alternative to conventional joining approaches.

Rapid transient-liquid-phase bonding of Al 2 O 3 with microdesigned Ni/Nb/Ni interlayers