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The influence of Cu content and Ni addition on the morphology and the growth kinetics of the intermetallic compound (IMC) layer formed at the interface of liquid Sn – Cu-based solders and the Cu substrate were investigated. The effects of temperature and reaction times on IMC morphology and thickness were studied. The reaction of a Sn-1.4Cu alloy with the substrate leads to the formation of a layer of Cu 6 Sn 5  (-phase) of typical scallop morphology. At long reaction times, a Cu 3 Sn (-phase) is observed at the interface between the Cu substrate and the Cu 6 Sn 5  layer. A small nickel addition to a Sn-0.6Cu alloy significantly changes the IMC morphology, accelerates its growth kinetics, prevents the formation of the Cu 3 Sn layer and reduces the rate of substrate dissolution. The effective activation energy of growth of the IMC layer in the Sn – Cu – Ni alloy was determined.

Intermetallic compounds at the interface between Sn–Cu(–Ni) solders and Cu substrate