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Interfacial reactions between Sn, Sn-3.0 wt.% Ag-0.5 wt.% Cu (SAC) and an Au/Ni/SUS304 stainless steel (SUS304) substrate were conducted using the reaction couple technique at 240, 255 and 270 °C for 1 – 5 h. In the earliest stage of the reaction, only the Ni 3 Sn 4  phase was formed on the Sn/Au/Ni/SUS304 interface. As the reaction time increased to 4 h, the Ni layer was gradually consumed and the Ni 3 Sn 4  phase detached from the interface. Meanwhile, the Sn reacted with the SUS304 to form the FeSn 2  phase. In the SAC/Au/Ni/SUS304 reaction couple, both Ni 3 Sn 4  and Cu 6 Sn 5  phases were formed on the interface. When the reaction time exceeded 4 h, the Ni 3 Sn 4  phase disappeared; the Cu 6 Sn 5  phase was spread over the SUS304 surface and the FeSn 2  phase was formed on the SUS304 surface. The growth of intermetallic compounds can be described by the parabolic law and the reactions were diffusion-controlled.

Interfacial Reactions between Lead-Free Solders and the Multilayer Au/Ni/SUS304 Substrate