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Interfacial reactions and mechanical properties between the Cu and Pb-free solders, Sn-3.0Ag-0.5Cu and Sn-58Bi with addition of 0.1 to 1.0 wt.% Pb are investigated in this study. Two kinds of intermetallic compounds, scallop-shaped Cu 6 Sn 5  and plane layered Cu 3 Sn phases, were found in both Sn-3.0Ag-0.5Cu + Pb/Cu and Sn-58Bi + Pb/Cu couples. The intermetallic compound thickness increased with longer reaction times, higher reaction temperatures and greater Pb contents. The Cu 6 Sn 5  phase was the thicker intermetallic compound in the Sn-3.0Ag-0.5Cu + Pb/Cu couple. However, in the Sn-58Bi + Pb/Cu system, the Cu 3 Sn phase is the thicker intermetallic compound. Experimental results indicate that the higher Pb concentration in Sn-3.0Ag-0.5Cu or Sn-58Bi solders reduces the alloy liquidus temperature and increases the thickness of the intermetallic compound. Thicker intermetallic compounds reduce the mechanical strength of the solder joint.

Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints