English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The Au-Ge alloy is useful for bonding applications in microelectronic and optoelectronic packages. Also, recent investigations show that Au-Ge system could present a lead-free solder candidate. The results of characterization of the eutectic alloy from binary Au-Ge system are presented in this paper. Experimental research was done using thermal analysis (differential thermal analysis, DTA) and structural investigation by light optic microscopy (LOM) and scanning electron microscopy with EDS (SEM-EDS). The eutectic temperature of 359 °C was detected using thermal analysis, while eutectic structure was confirmed using microstructural analysis. Obtained results were compared with recent literature references and good mutual agreement was noticed.

Thermal and structural characteristics of a eutectic Au-Ge alloy