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Recently, the cost factor of raw materials has emerged continuous improvement of tin-copper solder alloys. This work aims to improve the microstructural and mechanical properties of the eutectic tin-copper solder alloys by addition of nickel, cobalt and indium. The temperature profile of reflow soldering in surface-mount assembly was simulated to produce realistic joint microstructures. Key properties for electronic soldering were characterized, i.e. melting behaviour, solidification beha-viour, wettability, electrical resistivity, microstructures and mechanical properties. The results showed that addition of Ni, Co and In can effectively improve the mechanical properties of Sn-0.7Cu solder alloy i.e. microhardness and shear strength by providing preferred interfacial morphology and formation of intermetallic compound precipitates. The new solder alloys also showed reduced liquidus and solidus temperatures whereas no significant degradation of other key properties were seen.

Characterization of Eutectic Sn-Cu Solder Alloy Properties Improved by Additions of Ni, Co and In