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Electroless plating (ELP) process using Pt and Pd colloid catalyst has been developed. Au, Pt and Cu metal ˆlms with su‹cient adhesion were successfully obtained without special treatment of substrate surfaces. Owing to the excellent catalytic property of the Pt nanoparticles, continuous gold thin ˆlms can be produced at room temperature using a simple cyanide-free gold electroless plating solution composed of chloroauric acid and hydrogen peroxide. Pd colloidal catalyst has been also developed for a novel Pt ELP process and for commercial Cu ELP process. The process requires no surface modiˆcations for the immobilization of the catalyst, and by simple post-annealing the adhesion of the plated ˆlms to various polymer ˆlms can be improved dramatically. We have thus developed an environment-friendly etchingless ELP process without the use of toxic and hazardous substances.

Etchingless Electroless Plating with High Adhesion to Plastics using Precious Metal Colloid Catalyst