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Scaling analysis of the surface roughness has been performed on copper films prepared by DC magnetron sputter deposition. The deposition was performed at Ar gas pressures of 2 and 10 Pa. Under both pressures, deposition rates were almost the same and were 1.1 nm/s. Self-affine parameters α and β were determined from a series of AFM topographs of films deposited for various periods (30180 min). At 10 Pa, the roughness parameter α was 0.60.7 and the dynamical parameter β was 0.9, while at 2 Pa, where the surface roughness grew more modestly, α was 0.50.7 and β was 0.6. The difference also appeared in the correlation lengthξ. The correlation length became larger as the deposition proceeded at 10 Pa, in accordance with the roughness evolution theory. On the other hand, it stayed almost constant at 2 Pa. The effect of gas pressure on the surface roughness is discussed.

Evolution of the Scaling of the Surface Roughness Observed on Sputtered Copper Films with Atomic Force Microscope.