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In years past, tin-lead alloys were used to solder together electrical components. However, health concerns arose from issues surrounding the use and disposal of heavy metals such as lead. After the passing of the Lead Exposure Reduction Act in 1993 in the U.S., and the European Union’s ban of lead in electronics taking effect in 2006, suitable alternatives for tin-lead solders have been pursued [1]. Extensive studies exist of the material properties of lead-free (LF) solders and their fluxes [2-11]. As use of LF solders increases worldwide, the need to create, test, and validate the properties of these solder alloys also has risen.

Lead-Free Solder Pull-Off Stress Comparison of a Novel Bump Pull Method with Conventional Hot/Cold Bump Pull Methods