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Molecular dynamics method is performed to investigate the force behavior between semi-spherical indenter and single crystal substrate based on eam and morse potentials and verlet algorithm. Effects of different temperature on the contact force, friction force, and normal force are compared, the resistance of substrate material and dislocation movement are analyzed. It shows that the single crystal copper material’s resist deformation level is limited by low temperature, and more failure atoms were accumulated under the direction of indenter indenting in high temperature. More larger chip atoms volume were produced in front of indenter as sliding speed increases, and also the chip volume add with sliding distance increases. Furthermore,the dislocated band in basis lies at the angle of 45 degree with the movement direction of indenter in contact progress. This results have significance in improving contact performance and reducing the adhesive contact failure happens

Effect of Temperature Variation on Adhesive Contact Force Behavior and Deformation of Substrate Based on Atomic Scale