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In this paper, finite element analysis was carried out to simulate the response of printed circuit board (PCB) assembly that fell and collided with a rigid surface using dropping simulation. The drop process was simulated by setting the drop parameters including falling directions and falling heights. The results revealed that 180°drop had the most severe damage for BGA solder joints. It also indicated that dynamic bending of the PCB resulted from the solder stress. Keywords-printed circuit board; ball grid array; simulation; drop

Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application