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It is obvious that mechanical stripping is unable to meet the requirements for the stripping of extremely thin wires. Laser stripping has been widely used for its easy integration with electromechanical equipment and high controllability. Currently most laser stripping devices have to utilize double lasers, resulting in high-cost. To solve this problem, a single-laser stripping platform based on automatic double-position flipping is designed. This platform can realize bidirectional stripping with only one laser through automatic double-position flipping. Compared with double-laser stripping platform, the single-laser one can meet the requirements of stripping production with slightly longer stripping time per row of wires but is only half the cost and of the same stripping quality, making it ideal for most medium and small companies. Research has been done on this device of mobile phone antenna stripping. The optimal process parameter has been obtained.

Design and Process Parameters Research of Single-Laser Stripping Platform Based on Automatic Double-Position Flipping Mechanism