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A novel environmental-friendly Cu-Sn high temperature solder paste was fabricated by mixing Cu powder, Sn powder and commercial purchased flux. Different type and content of the flux may significantly affect the thermal properties of the solder paste. The bonding layer was composed of compact Cu3Sn and loose Cu6Sn5. The thickness of the Cu3Sn layer increased with the extension of the bonding time. The high temperature (at 300°C) shear strength of the bonding layer bonded under pressure of 10MPa was 23 MPa.

Research on preparation and properties of isothermal solidification Cu-Sn high temperature solder paste