English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The purpose of this research is to reduce the defect parts per million (DPPM) of the thickness out of specification caused by module warpage. Six Sigma approach was applied and the 2 k full factorial design with three replicates at 95% confident level was used to determine the significant factors to the module warpage. The significant factors comprised dam temperature, fill temperature and curing temperature. Box- Behnken design was also used to optimize the level of the significant factors. The results suggest that the encapsulation machine dam temperature, fill temperature and the curing temperature should be set at 30° C, 65° C and 41° C, respectively. The confirmed runs show that DPPM of the thickness out of specification is reduced from 600 to 184.

Warpage Reduction for Integrated Circuit in an Electronics Manufacturing Plant