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The PECVD (Plasma Enhanced Chemical Vapor Deposition) process chamber is dynamic sealed by the Multi-layer Linkage Sealing Mechanism, which is installed in front of process boxes. The leak rate attach uniformity requirement of process gas and RF flow distribution. Meanwhile, The efficiency of aSi/uc tandem thin-film solar cell, which is produced by this tool, is higher than 12%on 1.43 m 2 .

Multi-Layer Linkage Sealing Mechanism on Solar Cell Tool