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BGA-via multi-chip module (MCM) was built by HFSS software, the return loss and insertion loss of MCM were obtained with different frequencies. The impacts of structure parameters included BGA radius, shield ring radius, the bonding pad radius and vertical hole apart from the shield hole distance on the return loss were studied. Studying results show that within a certain range, the return loss of BGA-via firstly increases then decreases as the increase of BGA radius, and the return loss decreases as the increase of shield ring radius, the anti-pad radius and vertical hole apart from the shield hole distance.

Analysis signal transitions characteristics of BGA-via multi-chip module