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With the power of LED gradually ascend, LED lighting lamps' heat problems also increasingly exposed. The paper is around the study of high power LED packaging of liquid cooling. Through comparative analysis of DLC metal base, aluminum nitride ceramics and alumina ceramic thermal performance, it is found that traditional packaging junction temperature varies greatly, and liquid packaging junction temperature difference is small. Thus, heat is mainly dissipated through convection of liquid, and the difference of junction temperature is small.

Simulation of Heat Radiation for High-power LED Liquid Packaging