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In this paper a drop on demand based method of joining metallic layers of about 20 µm thick- ness with Cu-conductors of 100 µm diameter is presented. The process is based on melting spherical preforms of copper based braze (CuSn12) with a liquidus temperature of 990 °C (1). In the process, a braze preform is induced into a ceramic capillary, molten by a laser pulse and expelled out of the machining head via nitrogen overpressure. After a flight phase the braze droplet wets the surface of the electrode structure and the copper resulting in a firm joint after solidification. The shear strengths of the joints were measured to be 31 MPa for joints on Al2O3 substrates and 37 MPa for joints generated on LTCC substrates with screen printed Ag electrode structures. The shear strengths after temperature shock tests according to DIN EN 60068-2-14 indicate good performance of the joints in harsh environments. The average resistivity of a joint was tested by four wire testing and found to be 1.56 ± 0.33 mΩ. The introduced setup is capable to join thin metallic layers of 30 - 15 µm thickness with cu conductors of 100 µm diameter without the need of flux.

High Temperature Laser Based Drop on Demand Micro Joining of Thin Metallic Layers or Foils using Bronze Braze Preforms