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Possibilities of increase of cutting speed at simultaneous increase of accuracy of coordinate movements and decrease of dynamical loads at initial, the most dangerous from emergence of chips and breakages, moment of interaction of 15–120 microns thick diamond wheel with a wafer having 250–500 microns thickness and diameter of 50–250 mm, at its chipping are shown. The table with a wafer makes reciprocal coordinate cyclic movements at cutting. In the course of its acceleration to working feed rate there are mechanical oscillations in the direction of driving, which have natural frequency. These oscillations can lead to a table deviation from the machine coordinate and to occurance of accelerations, significantly differ with predicted ones, at achievement of working feed rate and subsequent contact of a wafer with a diamond wheel. That can be considered at realization of a production cycle, and, in some cases, oscillations can be operated programmatically by the choice of rational ratios of values of working stroke, length of non-working stroke and free frequency that allows reducing or exclusion of chips and breakages of wafers and diamond wheel, reducing their thickness and increasing processing speed by 1,5–2 times. Possibilities of creation of combined system of drives which use allows exclusion emergence of mechanical oscillations are shown.

DYNAMICS OF TRANSITION PROCESSES IN DRIVE MECHANISM WITH FLEXIBLE COMMUNICATION AT WAFER SEPARATION BY A DIAMOND WHEEL