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Microsystems often require special attention to the thermal aspects, as they frequently integrate severe heat sources together with electronics. When Finite Element Method programs are used for the solution of these problems, difficulties different from normal ICs are encountered, like, for example, thin membranes with huge aspect ratios and natural and forced convection in microcavities. Some of these aspects are discussed for the example of ANSYS 5.1 simulations of a 3-D multichip microsystem including a thermopneumatic micropump. 1. Heat transport mechanisms in a microsystem Fig. 1 shows an example of a microsystem investigated in the European ESPRIT project BARMINT. It consists of a set of up to ten chips with variable functions. The chips are glued onto a silicon support, stacked and cast in epoxy. The resulting epoxy cube is reduced in size by sawing. During this step, the supports are also sawn through revealing cross-sections of the metal tracks. After metallizing the cube the metal is patterned by laser patterning. As well as the micropump the cube includes sensor, supply, test and signal processing chips. The sensor chip constitutes the bottom part of the liquid flow channel for the chemical and physical analysis and it is bonded onto a 1mm thick PYREX glass. The system is designed as a demonstrator for compatibility for biomedical applications. The pump is driven by thermopneumatic actuation. The power management of the system is of prime importance: consumption of the pump should be minimized and the temperature at the chips containing electronics Transactions on the Built Environment vol 12, © 1995 WIT Press, www.witpress.com, ISSN 1743-3509

Specific Problems of FEM Thermal Simulations for Microsystems