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Currently used electronic components (LED, processors, CCD matrices) are distinct for their increasingly dense packing of active elements and, consequently, higher heat loss power per a single element. The arising thermal barrier restricts the functionality and further development of components in their present-day form. Cooling systems (natural or forced types, including water cooling systems) sometimes fail to come up to the required standard. The paper discusses a concept whereby the operation of standard cooling systems is supported by incorporation of Peltier elements. A heat flow analysis is presented for systems containing: an electronic element – Peltier element – radiator, complete with a study of cooling efficiency and elements facilitating the process of design of such combined systems. Also, experimental data from tests examining the process of cooling in sample systems will be provided.

Peltier modules in cooling systems for electronic components