English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Laser based direct write exposure tool for advanced semiconductor packaging has been introduced into the market. The tool has unique features compared to existing high-pressure mercury lamp based exposure tools. The tool does not require any masks or reticles because it equips with state-of-the-art light valve called Grating Light Valve (GLV) along with high power laser unit producing wavelength of 355 nm. Minimum resolution that the tool is able to draw is 2m lines/spaces with overlay accuracy of equal to or less than 1 m at average plus 3, that satisfies most advanced packaging requirement as of today. In the paper, we will introduce the advantage of this type of exposure tool in the market and discuss about technical challenges.

Laser Based Direct Exposure to Photo Materials Used in Advanced Semiconductor Packaging