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Imprinting quality in thermal imprint lithography is influenced to a large extent by the defects caused by demolding between mold and resists. It’s necessary to investigate the demolding behavior of resists in contact detaching process. In this paper, von Mises stress and deformation of poly (methyl methacrylate) resists during demolding process were simulated and analyzed. A model considering adhesion and friction forces was adopted in the simulation of finite element method. The results indicated that stress concentration occurred at two places in the resists. Then stress concentration and deformation in resists were explained by means of simulating the evolution of demolding contact forces. Furthermore, contact forces of key locations were compared and related regularities were proposed. Depending on these regularities, targeted measures can be applied to protect different locations of resists.

Analysis of Von Mises Stress and Deformation of Resists during Demolding Process of Nanoimprinting