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We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazonaphthoquinone sulfonate. After soft baking, 10-14% of solvent was remained. Below 120°C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130°C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120°C for 4min is suitable soft baking condition in this study.

Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide