English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

A negative-working photosensitive polyimide (PI) precursor based on a low dielectric polyimide precursor having a low coefficient of thermal expansion (CTE) and 1,4-dihydropyridine (DHP) as a photosensitive compound has been developed. Co-polyamic acid(Co-PAA)s were prepared by ring-opening polyaddition of aromatic dianhydrides with diamines. The dissolution behavior of Co-PAAs containing DHP after exposure was studied and it was found that the difference of dissolution rate between the exposed and unexposed parts was enough to get a high contrast due to the photochemical reaction of DHP in the polymer film. The cured CoPI film at 3 80 °C showed the low coefficient of thermal expansion of 20 ppm and the low dielectric constant of 2.7 at 1 MHz. Keywards: photosensitive polyimide, highly dimensional stability, low dielectric constant, 1,4-dihydropyridine, negative type, propagation velocity

Development of Photosensitive Polyimide with Low Dielectric Constant.