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In this work, the electroplating of copper on an aluminum substrate without electrochemical surface treatment was investigated. Electroplating of copper on aluminum substrate was prepared from copper sulfate electrolyte bath with various current densities 1 mA/cm2, 3 mA/cm2, 10 mA/cm2, and 40 mA/cm2. The effects of current density on the samples properties were characterized using a different technique. The surface morphology, crystallographic orientation, and corrosion resistance of the Copper film were analyzed using a scanning electron microscope, energy dispersive spectroscopy (SEM-EDS), X-ray diffractometer (XRD), and potentiostat. The samples' surface morphology is changed with different current densities because nucleation is driven by transferring the copper ion rate onto the aluminum substrate. The Cu-10 sample exhibits (111) peak higher and the best corrosion resistance than other samples. Moreover, Cu-1 samples have shifted to positive corrosion voltage (Ecorr) than the other samples. Keywords— Electroplating, Copper, Aluminum, Copper sulfate bath

Effect of Current Density on Crystallographic Orientation, and Oxidation Behavior of Copper Plated on Aluminum Substrate