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The purpose of structural health monitoring is to provide information by making a simultaneous diagnosis of the status of the structure. Despite aging, environmental conditions and unforeseen circumstances, the construction should remain as specified in the design. Changing the environmental conditions causes the sensor and the host structure to change material properties. It is essential to take into account environmental conditions to prevent misdiagnosis. Therefore, the real cause of the change can be determined. In this study, the behavior of constrained piezoelectric wafer active sensor (PWAS)/Al 7075 was investigated by using electromechanical impedance method (EMI) under changing environmental conditions. Numerical studies on this material in the literature are limited and all the experimental/ numerical results are compensated for the temperature effect and analyzed using curve/probabilistic fitting approach for the first time. The sample used in the experimental work was modeled in ANSYS finite element program. In the experimental and numerical results, it has been observed that as the temperature decreases, the frequency shifts to the right and the amplitude increases. The experimental and simulation results were nearly the same. The temperature effect was compensated using the compensation algorithm for experimental and numerical studies. The results were compared using damage metrics. The experimental results analyzed using a curve/probabilistic fitting approach.

Curve/Probabilistic Fitting of Damage Metrics for Al-7075 Materials Behavior by Using Electromechanical Impedance Method