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To improve the joint strength of the joint of the Ni-P/Cu plated Al alloy and the Cu alloy for a water cooling system, fluxless bonding was conducted with Sn-Cu solder foil in a vacuum. In the joint bonded at 250°C, fracture easily occurs at the joint interface due to insufficient interfacial reaction and shear strength is relatively low. In the joint bonded at 350°C, the excess growth of the Cu 3 Sn layer in the Cu 6 Sn 5 /Cu interface and the large void formation in the joint degrade shear strength. On the contrary, in the joint bonded at 300°C, both the excess growth of the Cu 3 Sn layer and the large void formation are prevented, and thus shear strength becomes relatively high. When bonding was conducted under the optimum conditions, which are bonding temperature of 300°C, bonding time of 20 min and applied stress of 0.2 MPa, shear strength became 33.4 MPa. This value is approximately four times that of the joint bonded with flux.

Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil