English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Among various lead-free alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering technology. Moreover, to improve the characteristics of lead-free solders, the effect of the addition of minor elements to lead-free solders on the properties of solder and interfacial reactions have been studied. The purpose of this research was to investigate the addition of Ni or Co to the Sn-Ag solder on the microstructure and the joint strength of the interface with metallization layer of the substrate. As a metallization layer of the substrate, bare Cu and electroless Ni-P plating were used. For the reflow process, test samples were heated in a radiation furnace at 523K for 60 s, and for the aging process, some samples were heat-treated in an oil bath at 423K for 168 h, 504 h and 1008 h. Results show the addition of Ni or Co was effective for the IMC formation and growth at the interface with a Cu pad during reflow and aging process, and the addition of Co, except Ni, affected the pull strength of the solder joint with electroless Ni-P plating during aging process. [doi:10.2320/matertrans.MF200851

Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface