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To investigate interfacial phenomena related to the evolution of electrical conductivity in electrically conductive adhesives containing silver llers, the curing processes of model adhesives composed of an amine-cured epoxy-based binder were examined using several analytical methods. Shrinkage of the adhesives during curing was not a predominant factor in determining the electrical resistivity. Rearrangement of the llers occurred at the onset of gelation. Afterwards, the electrical conductivity evolved in the adhesives through the following two steps: development of conduction paths during gelation of the epoxy-based binder, and microstructural evolution between the silver llers. The use of adipic acid as a surfactant enhanced the rst of these steps during gelation. The latter process occurred concurrently with cross-linking of binder molecules to increase the elastic modulus. In this step, the amine molecules probably reacted with silver llers to induce necking between the llers. Because interfacial chemical phenomena probably in uence the electrical conductivity evolution, the conventional hypothesis, which is based on the mechanical contact concept for interller contacts in electrically conductive adhesives, needs to be expanded. [doi:10.2320/matertrans.MD201511]

Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder