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In this study, we were able to form strong Au-to-Au joints using a silver oxide (Ag2O) paste sintered at 300°C. We successfully reduced the processing pressure applied during sintering by 0.5 MPa by optimizing the sintering conditions. Through X-ray diffraction phase analysis as well as crystallite size calculations, we observed a signi cant reduction (27%) in the crystallite size as the heating rate was increased from 10°C/ min to 180°C/min. Scanning electron microscopy cross-sectional observations con rmed that the high heating rate facilitated sintering within the bonding layer. The bonded shear strength (maximum of 24 MPa) was higher than that of the conventional Pb-5Sn solder (18 MPa), proving the suitability of Ag2O paste as a potential lead-free bonding material for high-temperature applications. [doi:10.2320/matertrans.MA201602]

Decrease in Process Pressure for Forming Au-to-Au Joints via Reduction Reaction of Ag<sub>2</sub>O