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For applications in smart textiles, flip-chip bonding was applied with either an anisotropic conductive adhesive (ACA) or a nonconductive adhesive (NCA) to a heat-resistant fabric and a Si substrate as a reference. The average contact resistances of the flip-chip joints produced with each adhesive on each substrate were evaluated with varying the Cu and Sn thicknesses inversely over the range of 0­15μm to maintain a total thickness of 15 μm of the Cu/Sn bump. The contact resistances of the flip-chip joints produced with ACA on Si, NCA on Si, ACA on fabric, and NCA on fabric were 6.5­12.2m3, 15.6­26.5m3, 5.3­10.2m3, and 5.5­10.1m3, respectively. [doi:10.2320/matertrans.M2015106]

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Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications