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Each electrical resistivity of the ternary solder alloy of tin­copper­sulfur was compared to that of the binary solder alloy of tin­copper. A mixture of various tin, copper, and sulfur powder compositions was prepared by adding different amounts of sulfur into a eutectic composition of tin and copper. After each specimen axially compressed with 10MPa was sintered at 250°C, tin sulfide was induced in the solder alloy because sulfur reacted with tin. Simultaneously, the oxide layers of the solder alloy were removed through a complicated combustion reaction between tin sulfide and tin oxide. As a result, the electrical resistivity of the ternary solder alloy (Sn-0.70Cu-0.32S) having 0.32mass% of sulfur was reduced to at most 10.56μ3·cm, compared to 12.47μ3·cm of the binary solder alloy (Sn-0.70Cu) without sulfur. [doi:10.2320/matertrans.M2014102]

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Reduced Electrical Resistivity of Ternary Solder Alloy of Tin&amp;ndash;Copper&amp;ndash;Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin&amp;ndash;Copper