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This study presents an electrical current testing that is based on the Sn­xAg­0.5Cu (x = 1, 3mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu6Sn5+Ag3Sn) and the base phases (¢-Sn). The eutectic phases in the Sn­3Ag­0.5Cu (SAC305) alloy presented a continuous distribution, and its amount was higher. After soldering, the Cu6Sn5 and Ag3Sn IMCs were found at the interfaces, and their morphologies were dominated by Ag contents in the Sn­Ag­Cu (SAC) solder. The whole interfacial characteristics of IMCs were affected after biasing for 40h. The growth behavior of these IMCs was controlled by the bias-induced thermal diffusion mechanism and the evolution of IMC morphology was dominated by the growth dynamics. The IMCs, formed at the interfaces (SAC/Cu, SAC/Ag), dominated the series resistance of the PV ribbon. [doi:10.2320/matertrans.M2013110]

Effects of Electrical Current on Microstructure and Interface Properties of Sn&ndash;Ag&ndash;Cu/Ag Photovoltaic Ribbons

Effects of Electrical Current on Microstructure and Interface Properties of Sn–Ag–Cu/Ag Photovoltaic Ribbons