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In this study, surface roughness values of electrodeposits from chloride solution (0.1mol/L CuCl, 0.05mol/L HCl and 4.0mol/L NaCl electrolytes) under potentiostatic conditions were characterized in terms of root mean square roughness (RMS roughness) using a Mirau interferometer, an optical microscope, and computer software analysis. Avariety of organic additives were used to study their influence on RMS roughness values. The surface roughness of copper electrodeposits in the presence of gelatin (RMS roughness = 0.38µm) is significantly lower than in the absence of additives (RMS roughness = 15.19µm). The use of gelatin also resulted in lower roughness than other additives (RMS roughness ranging from 16.75 to 3.30µm). The copper electrodeposition tests were performed under rotating disk electrodeposition conditions (100mV cathodic overpotential for 1h under argon purging at 500rpm). The effect of additive concentration on RMS roughness values was also evaluated. As cathodic overpotential and deposition time increased, the RMS roughness increased at low overpotential and deposition time. RMS roughness did not increase significantly at longer deposition times in the presence and absence of gelatin. [doi:10.2320/matertrans.M2012095]

The Influence of Organic Additives on Surface Microroughness of Copper Deposits from Cuprous Solution under Potentiostatic Conditions