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The sticking of product material to injection molding tools is a serious problem, which reduces productivity and reliability. Depositing alloy nitride coatings (TiN, ZrN, CrN, and TiAlCrN) using closed field unbalanced magnetron sputter ion plating and electrodeposition of chromium, and characterizing their surface free energies in the temperature range 20–120  C have led to the development of a non-sticking (with a low surface free energy) coating system for semiconductor IC packaging molding dies. The contact angles of water, diiodomethane and ethylene glycol on the coated surfaces were measured at temperatures in the range 20–120  C using a Dataphysics OCA-20 contact angle analyzer. The surface free energy of the coatings and their components (dispersion and polar) were calculated using the Owens-Wendt geometric mean approach. The surface roughness of these coatings were investigated by atomic force microscopy (AFM). The adhesion force of these coatings were measured using direct tensile pull-off test apparatus. The experimental results revealed that TiAlCrN, CrN and ZrN coatings outperformed Hard-Cr and TiN coatings in terms of anti-adhesion, and thus have the potential as working layers for injection molding industrial equipment, especially in semiconductor IC packaging molding applications. [doi:10.2320/matertrans.47.2533]

Surface Free Energy of Alloy Nitride Coatings Deposited Using Closed Field Unbalanced Magnetron Sputter Ion Plating