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This study has been supported by the CEPM (Center for Electronic Packaging Materials) of the KOSEF (Korea Science and Engineering Foundation). Many discussions with Profs. S.-J. L. Kang and D. Y. Yoon at KAIST are gratefully acknowledged.

Abnormal Grain Growth of Ni<SUB>3</SUB>Sn<SUB>4</SUB> at Sn-3.5Ag/Ni Interface