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The wetting time, wetting force, contact angle and interfacial reaction of Sn-8.55Zn-0A5Al-XAg (mass%) and Sn-9Zn (mass%) lead-free solders on Cu and Cu/Ni-P/Au substrates have been investigated. The Ag content, X, of thesolders investigated was 0-3 mass%. The results indicate that the wettability of Sn-8.55Zn-0A5Al-XAg solders decreases with increasing Ag content. The Sn-8.55Zn-0.45Ai-XAg. solders containing low Ag content, less than 1mass%, exhibit better wettability than the eutectic Sn-9Zn solder. Furthermore, it was also found that the wettability of Sn-Zn based solders on Cu substrate is better than that on Cu/Ni-P/Au substrate, The when used on Cu and Cu/Ni-P/Au, Sn-9Zn solder forms Cu 5 Zn 8 and AuZn 3 respectively, while the Al-containing solders form Al 4 . 2 Cu 3 . 2 Zn 0 . 7 and Al 2 (Au, Zn). Further addition of Ag gave rise to AgZn 3 particles attached to the underlying intermetallic compound.

Wetting Properties of and Interfacial Reactions in Lead-free Sn-Zn Based Solders on Cu and Cu Plated with an Electroless Ni-P/Au Layer